This inventor holds 1 USPTO granted patent and 1 published patent application and 2 EPO patents. Top assignee: Meta Platforms, Inc.. Active years: 2023.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2023
Title: David Sebastien Mortenson: Innovator in Integrated Circuit Cooling Solutions
Introduction
David Sebastien Mortenson is a notable inventor based in Redwood City, CA (US). He has made significant contributions to the field of integrated circuit (IC) packaging, particularly in cooling systems. His innovative approach addresses the critical need for efficient thermal management in electronic devices.
Latest Patents
Mortenson holds a patent for an "IC package with embedded fan-based cooling system." This patent describes an IC package that includes an IC die carrying electronic circuitry, an encapsulation material that partially covers the IC die, and a plurality of microfans located in cavities defined by the encapsulation material. Additionally, the package features sensors embedded in the encapsulation material, which produce signals indicating temperature at specific locations. This invention represents a significant advancement in cooling technology for IC packages.
Career Highlights
David Mortenson is currently employed at Meta Platforms, Inc., where he continues to develop innovative solutions in the realm of electronic packaging and cooling systems. His work is instrumental in enhancing the performance and reliability of electronic devices.
Collaborations
Mortenson collaborates with various professionals in his field, including his coworker Narsing Krishna Vijayrao. Their combined expertise contributes to the advancement of technology at Meta Platforms, Inc.
Conclusion
David Sebastien Mortenson is a pioneering inventor whose work in IC packaging and cooling systems is shaping the future of electronic device performance. His contributions are vital in addressing the challenges of thermal management in modern technology.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
