The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 31, 2023

Filed:

Feb. 17, 2021
Applicant:

Meta Platforms, Inc., Menlo Park, CA (US);

Inventors:

Narsing Krishna Vijayrao, Santa Clara, CA (US);

David Sebastien Mortenson, Redwood City, CA (US);

Assignee:

Meta Platforms, Inc., Menlo Park, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20209 (2013.01); H05K 7/20154 (2013.01); H05K 7/20172 (2013.01); H05K 7/20463 (2013.01);
Abstract

The disclosed IC package may include (1) an IC die carrying electronic circuitry, (2) an encapsulation material that at least partially covers the IC die, where the encapsulation material defines a plurality of cavities in a top surface of the encapsulation material, (3) a plurality of microfans located in the plurality of cavities, and (4) a plurality of sensors embedded in the encapsulation material, where each sensor of the plurality of sensors produces a signal indicating a temperature at a location of the sensor. Various other IC packages, as well as associated cooling systems and methods, are also disclosed.


Find Patent Forward Citations

Vijayrao, Narsing. (2023). Ic package with embedded fan-based cooling system (U.S. Patent No. 11570930). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11570930

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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