David Rosenthal

Title: The Innovative Contributions of David Rosenthal

Introduction

David Rosenthal is a notable inventor based in Fishkill, NY (US). He has made significant contributions to the field of materials science, particularly in the area of interconnect technology. His innovative approach has led to the development of a unique method for void-free filling of features in substrates.

Latest Patents

David holds a patent for a method titled "Ruthenium metal feature fill for interconnects." This patent describes a process that includes providing a substrate containing features, depositing a Ru metal layer in the features, and subsequently removing the Ru metal layer from the field area around the opening of the features. The method further involves depositing additional Ru metal in the features at a higher rate than on the field area, ensuring that the features are fully filled with Ru metal. This innovative technique addresses challenges in the manufacturing process and enhances the reliability of interconnects.

Career Highlights

David Rosenthal is currently employed at Tokyo Electron Limited, a leading company in the semiconductor manufacturing equipment industry. His work at Tokyo Electron has allowed him to collaborate with other talented professionals in the field, contributing to advancements in technology and innovation.

Collaborations

Some of David's coworkers include Kai-Hung Yu and Nicholas Joy. Their collaborative efforts have fostered a creative environment that encourages the development of groundbreaking technologies.

Conclusion

David Rosenthal's contributions to the field of materials science and interconnect technology exemplify the spirit of innovation. His patent for void-free Ru metal filling showcases his commitment to advancing manufacturing processes. Through his work at Tokyo Electron Limited, he continues to make a significant impact in the industry.