Boulder, CO, United States of America

David Richard Zywotko

USPTO Granted Patents = 1 

Average Co-Inventor Count = 7.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2020

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1 patent (USPTO):Explore Patents

Title: **David Richard Zywotko: Innovating Thermal Atomic Layer Etching**

Introduction

David Richard Zywotko is an accomplished inventor based in Boulder, Colorado. He has made significant contributions to the field of atomic layer etching (ALE), a critical process in material science and semiconductor manufacturing. His work has the potential to enhance the efficiencies and capabilities of surface processing technologies.

Latest Patents

David holds one patent titled "Enhancement of Thermal Atomic Layer Etching." This innovative method promotes atomic layer etching of surfaces through sequential reactions that involve a metal precursor and a halogen-containing gas. Furthermore, his invention enhances the etching rate by focusing on the removal of residual species that are bound to or adsorbed onto the surface, a vital aspect for achieving superior material characteristics.

Career Highlights

Currently, David Richard Zywotko is associated with the University of Colorado, where he continues to push the boundaries of research in thermal atomic layer etching. His contributions to the field not only highlight his inventiveness but also reflect his commitment to advancing technological innovations.

Collaborations

Throughout his career, David has had the opportunity to collaborate with esteemed colleagues, including Steven McClellan George and Nicholas Ray Johnson. These partnerships have enriched his research and helped foster a collaborative environment that encourages innovative solutions in materials science.

Conclusion

David Richard Zywotko exemplifies the spirit of innovation in the realm of atomic layer etching. His patent highlights a significant advancement that could transform practices within the semiconductor industry. With continued research at the University of Colorado and collaborations with fellow experts, David is poised to make lasting contributions to technology and materials science.

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