David R Pugne

Title: David R Pugne: Innovator in Epoxy Adhesive Technology

Introduction

David R Pugne is a notable inventor based in Erie, PA (US). He has made significant contributions to the field of adhesive technology, particularly with his innovative patent related to epoxy adhesives. His work is recognized for its practical applications in various industries.

Latest Patents

David R Pugne holds a patent for a low read-through epoxy-bonded SMC. This invention discloses a two-part epoxy adhesive composition that comprises an epoxy compound, an optional amine hardener, an optional hydroxy-substituted aromatic compound, and a specific ratio of liquid terminal epoxy reactive groups and amidoamine. The adhesive is designed to be applied as a mixture of first and second parts in a volume ratio of 1:1.4 to 1:3.0. This innovative adhesive provides bonding of SMC with low or no read-through, initial and aged fiber tearing bonds, and specified bond strength minimum at 400°F (204°C).

Career Highlights

David R Pugne is associated with Lord Corporation, where he has been instrumental in developing advanced adhesive solutions. His expertise in epoxy technology has positioned him as a key player in the field, contributing to the company's reputation for innovation.

Collaborations

David has collaborated with Dennis J Damico, working together to enhance the capabilities and applications of adhesive technologies. Their partnership has led to advancements that benefit various sectors.

Conclusion

David R Pugne's contributions to epoxy adhesive technology exemplify innovation in the field. His patent for low read-through epoxy-bonded SMC showcases his commitment to developing effective solutions for industry challenges.