Lord Corporation

David R Pugne

Dennis J Damico

What is disclosed is a 2-part epoxy adhesive composition comprises an epoxy compound, an optional amine hardener, optional hydroxy-substituted aromatic compound, and from 20% to 60% of the total weight of adhesive combined of liquid terminal epoxy reactive groups and amidoamine, whereby the adhesive is applied as a mixture of first and second parts in a volume ratio of the first epoxy part: second cure part of 1:1.4 to 1:3.0. The adhesive is adapted to provide bonding of SMC with low or no read-through, initial and aged fiber tearing bonds and specified bond strength minimum at 400&deg; F. (204&deg; C.).

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Erie, PA, United States of America

David R Pugne