This inventor holds 2 USPTO granted patents. Top assignee: Creeled, Inc.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: David Peoples and Semiconductor Package Mounting Innovations.
Introduction
David Peoples is an inventor based in Raleigh, North Carolina. His patent work addresses semiconductor packaging, with a focus on mounting arrangements that can improve component placement during solder reflow. He is associated with Creeled, Inc. and holds 2 patents.
Latest Patents
“Mounting Arrangements for Semiconductor Packages and Related Methods” describes substrate metal pads with selectively placed solder material. During reflow, the solder spreads across previously uncovered portions of the pads, moving semiconductor packages into controlled positions. The disclosed patterns can guide the direction of movement and achieve closer spacing than the placement equipment used for initial positioning may allow.
Career Highlights
Peoples’s disclosed work focuses on the practical challenges of positioning semiconductor packages on substrates. By using pad geometry and selective solder placement to influence movement during reflow, the approach offers a way to refine component spacing after initial placement.
Collaborations
Peoples’s listed coworkers include Timothy Ling and Ryan Mohn. The patent information provided identifies Creeled, Inc. as his company.
Conclusion
David Peoples’s patent work explores how carefully designed metal pads and solder patterns can guide semiconductor packages into precise mounting positions during reflow.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile