David P Lapotin

Title: David P. Lapotin: Innovator in Semiconductor Technology

Introduction

David P. Lapotin is a notable inventor based in Carmel, NY (US). He has made significant contributions to the field of semiconductor technology, holding a total of 2 patents. His work focuses on enhancing the functionality and efficiency of semiconductor packages and interposer modules.

Latest Patents

David's latest patents include a "Semiconductor chip interposer module with engineering change wiring" and "Integrated circuit carriers and a method for making engineering changes." The first patent describes a semiconductor package designed to support and interconnect semiconductor chips. This package features an interposer module that connects the chips' contact lands to a substrate's contact surface, utilizing conductive vias and a distributed capacitance layer. The second patent outlines an integrated circuit carrier that includes a modular substrate with device terminals and engineering change pads, allowing for unique electrical connections through an engineering change network.

Career Highlights

David P. Lapotin is currently employed at International Business Machines Corporation (IBM), where he continues to innovate in semiconductor technology. His work has been instrumental in advancing the capabilities of integrated circuits and semiconductor packaging.

Collaborations

Throughout his career, David has collaborated with notable colleagues, including Dudley A. Chance and Timothy Rea Dinger. These collaborations have contributed to the development of cutting-edge technologies in the semiconductor industry.

Conclusion

David P. Lapotin's contributions to semiconductor technology through his patents and work at IBM highlight his role as a key innovator in the field. His advancements continue to shape the future of electronic devices and integrated circuits.