International Business Machines Corporation

David P Lapotin

Dudley A Chance

Timothy Rea Dinger

David B Goland

Evan Ezra Davidson

Walter V Vilkelis

A semiconductor package is described for supporting and interconnecting semiconductor chips, each chip having contact lands on a contact surface, the package also including a substrate with a contact surface. An interposer module is disposed between at least one chip's contact surface and the substrate's contact surface. The interposer module has first and second opposed surfaces and a first plurality of contact locations positioned on its first surface which mate with a chip's contact land. A second plurality of contact locations on the interposer modules second surface are positioned to mate with contact lands on the substrate. A set of conductive vias are positioned within the interposer module and connect the first plurality of contact locations with a first subset of the second plurality of contact locations. A distributed capacitance layer is positioned within the interposer and is adjacent to its first surface. Adjacent to the second surface are X and Y lines which can be used to make engineering change interconnections.

Semiconductor chip interposer module with engineering change wiring and

An integrated circuit carrier comprising a modular substrate having an upper surface, a multitude of electrically conducting device terminals on the upper surface of the substrate, a multitude of electrically conducting engineering change pads also on the upper surface of the substrate, and an engineering change network to form a unique electrical connection between each of an arbitrary subset of the device terminals and each of an arbitrary subset of the engineering change pads. The engineering change network includes a multitude of connecting pads, and a multitude of first, second, and third conductive leads or wires, and each of the connecting pads includes first and second spaced apart sections.

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Carmel, NY, United States of America

David P Lapotin