David N Randolph

Title: David N. Randolph and Semiconductor Package Mounting Innovations.

Introduction

David N. Randolph is an inventor associated with Wake Forest, North Carolina, and Creeled, Inc. His patent work includes innovations in mounting semiconductor packages, with a focus on how solder patterns can guide component placement during manufacturing. Randolph is credited with 2 patents.

Latest Patents

Randolph’s latest listed patent is “Mounting Arrangements for Semiconductor Packages and Related Methods.” The invention describes metal pads on substrates and selectively placed solder material on portions of those pads. Semiconductor packages are initially positioned over the solder and pad surfaces. During reflow, the solder spreads across previously uncovered areas of the pads, moving the packages into their intended positions.

The patent describes patterns of metal pads and solder that control the direction of this movement. This approach can achieve package spacing closer than the placement limits of the pick-and-place equipment used at the start of assembly.

Career Highlights

Randolph’s listed patent portfolio comprises two patents. His disclosed work addresses a practical semiconductor manufacturing challenge: achieving precise component spacing through carefully designed pad and solder arrangements.

Collaborations

Randolph is associated with Creeled, Inc. His listed coworkers include Timothy Ling and Ryan Mohn.

Conclusion

David N. Randolph’s patent work highlights how controlled solder reflow can improve the positioning and spacing of semiconductor packages during assembly.