This inventor holds 2 USPTO granted patents and 3 published patent applications and 1 EPO patent. Top assignee: Rockwell Collins, Inc.. Active years: 2021-2022.
Company Filing History:
Years Active: 2021-2022
Title: David L. Westergren: Innovator in Semiconductor Technology
Introduction
David L. Westergren is a notable inventor based in Marion, IA (US). He has made significant contributions to the field of semiconductor technology, holding a total of 2 patents. His work focuses on advanced methods and systems that enhance the performance and integration of semiconductor devices.
Latest Patents
Westergren's latest patents include a "System and method for extreme performance die attach" and a "Vertically integrated circuit assembly." The first patent discloses a method for fabricating semiconductor die with die-attach preforms. This method involves applying an uncured die-attach paste material to a surface of a forming substrate made from a hydrophobic material, curing the preforms, and bonding a semiconductor die to these preforms. The second patent describes a vertically integrated circuit assembly that includes a substrate with electrical traces and multiple circuit assembly layers. This design allows for efficient signal routing and integration of various integrated circuit components.
Career Highlights
David L. Westergren is currently employed at Rockwell Collins, Inc., where he continues to innovate in the semiconductor field. His expertise and contributions have positioned him as a key figure in the development of advanced electronic systems.
Collaborations
Westergren has collaborated with notable colleagues such as Nathan P. Lower and Brian K. Otis, further enhancing the innovative environment at Rockwell Collins, Inc.
Conclusion
David L. Westergren's work in semiconductor technology exemplifies the spirit of innovation and collaboration in the field. His patents reflect a commitment to advancing electronic systems, making a lasting impact on the industry.