The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 28, 2022
Filed:
Aug. 02, 2019
Rockwell Collins, Inc., Cedar Rapids, IA (US);
Nathan P. Lower, North Liberty, IA (US);
Haley M. Steffen, Cedar Rapids, IA (US);
Ross K. Wilcoxon, Cedar Rapids, IA (US);
David L. Westergren, Marion, IA (US);
Brian K. Otis, Solon, IA (US);
Pete Sahayda, Cedar Rapids, IA (US);
Rockwell Collins, Inc., Cedar Rapids, IA (US);
Abstract
A method for fabricating semiconductor die with die-attach preforms is disclosed. In embodiments, the method includes: applying an uncured die-attach paste material to a surface of a forming substrate to form one or more die-attach preforms, the surface of the forming substrate formed from a hydrophobic material; curing the one or more die-attach preforms; performing one or more planarization processes on the one or more die-attach preforms; coupling a first surface of a semiconductor die to a handling tool; and bonding a second surface of the semiconductor die to at least one die-attach preform of the one or more die-attach preforms.