This inventor holds 1 USPTO granted patent. Top assignee: Intel Corporation. Active years: 2014.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2014
Title: David L. Budka: Inventor in Through-Silicon Imaging
Introduction
David L. Budka is an inventor based in Langhorne, Pennsylvania, and is associated with Intel Corporation. His patent work addresses imaging and probing through silicon.
Latest Patents
Budka is named on 1 patent: “Through Silicon Imaging and Probing.” The invention uses a light source to project unpolarized light onto a device under test. A pellicle reflects light toward the device while allowing reflected light to pass through to a camera or other image-capture device. Linear polarizers or half-wave plates can help provide the desired polarization, improving the image captured for inspection.
Career Highlights
Budka’s patent reflects work on optical techniques for examining devices under test. The approach combines controlled light polarization with a pellicle-based optical path to support imaging and probing through silicon.
Collaborations
His listed coworkers include Baohua Niu and Patrick Pardy. The patent information provided identifies Budka’s association with Intel Corporation.
Conclusion
David L. Budka’s patent on through-silicon imaging and probing describes an optical method designed to improve device inspection through carefully managed illumination and polarization.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile