Rancho Palos Verdes, CA, United States of America

David Joseph Brunone

This inventor holds 11 USPTO granted patents. Top assignees: Northrop Grumman Systems Corporation, Trw Limited, Northrup Grumman Corp.. Active years: 2001-2008.

IDiyas Innovation Intelligence. (2026). Inventor Profile: David Joseph Brunone. Retrieved from https://idiyas.com/inventor/david-joseph-brunone

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 3.4

ph-index = 7

Forward Citations = 161(Granted Patents)


Company Filing History:


Years Active: 2001-2008

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11 patents (USPTO):Explore Patents

Title: The Innovative Contributions of David Joseph Brunone

Introduction

David Joseph Brunone is a notable inventor based in Rancho Palos Verdes, California. He holds a total of 11 patents, showcasing his significant contributions to the field of microwave integrated circuits. His work has advanced the technology used in various electronic applications.

Latest Patents

Among his latest patents is the "Thickness Tapered Substrate Launch." This technique focuses on interconnecting monolithic microwave integrated circuits (MMICs) on a substrate. The method involves fabricating substrate sections that facilitate such interconnections. A MMIC is strategically positioned in a gap within the substrate, where conventional microwave transmission lines are formed for interconnection purposes. The substrate is tapered in thickness on each side of the gap, transitioning from the normal thickness to the smaller thickness of the MMIC. This design ensures uniform transmission line characteristics, particularly maintaining the characteristic impedance. Additionally, small connector ribbons provide the necessary electrical connections between the tapered transmission lines and the MMIC.

Another significant patent is the "Broadband DC Block Impedance Matching Network." This apparatus features a substrate with a microstrip line and a capacitor placed at a predetermined location along the line, creating a discontinuity. A ground plane assembly on the substrate includes an opening that compensates for the capacitor's discontinuity, enhancing the overall performance of the device.

Career Highlights

David has worked with prominent companies such as Northrop Grumman Systems Corporation and TRW Limited. His experience in these organizations has contributed to his expertise in microwave technology and circuit design.

Collaborations

Throughout his career, David has collaborated with notable individuals, including Barry Ross Allen and Mark Kintis. These partnerships have likely enriched his work and led to innovative solutions in the field.

Conclusion

David Joseph Brunone's contributions to microwave integrated circuits through his patents and collaborations highlight his role as a significant inventor in the industry. His innovative techniques continue to influence advancements in electronic applications.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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