Northrop Grumman Systems Corporation

Trw Limited

Northrup Grumman Corp.

David Joseph Brunone

Barry Ross Allen

Mark Kintis

Andrew Donovan Smith

Donald R Martin

Vincent C Moretti

William Marvin Skones

Shimen K Claxton

Craig R Talbott

Bert K Oyama

James A Hathaway

Alex Chau

Michelle M Reyes

Janice Allen, Legal Representative

Eric L Upton

Ronald P Smith

Yun H Chung

Dahweih Duan

Daniel Kwok-hung Ko

A technique for interconnecting monolithic microwave integrated circuits (MMICS) on a substrate, and a method for fabricating substrate sections that facilitate such interconnection. A MMIC is positioned in a gap in the substrate, on which are formed conventional microwave transmission lines for purposes of MMIC interconnection. On each side of the gap, the substrate is tapered in thickness between the normal substrate thickness and the much smaller thickness of the MMIC. The transmission lines in this transition region are tapered in width as the substrate is tapered in thickness, thereby maintaining uniform transmission line characteristics, particularly the characteristic impedance of the transmission line. Small connector ribbons provide electrical connection between the tapered transmission lines and the MMIC. A method is also disclosed for fabricating multiple substrate sections for use in the structure of the invention.

Thickness tapered substrate launch

An apparatus in one example has: a substrate having a microstrip line; a capacitor at a predetermined location along the microstrip line, the capacitor producing a discontinuity; and a ground plane assembly on the substrate, the ground plane assembly having an opening that compensates for the discontinuity of the capacitor.

Broadband DC block impedance matching network

Systems are disclosed for providing a DC-bias network for a RF distributed amplifier. One embodiment may include a DC-bias network comprising a planar substrate having an input port configured to receive a DC input signal and provide a DC bias at an output port, a microstrip line mounted to the planar substrate and interconnecting the input port and the output port, and a plurality of RF resonators coupled to the microstrip line. Each of the plurality of RF resonators are configured to provide a substantially constant impedance for a respective portion of the frequency band of the RF signal.

DC-bias network for a distributed amplifier

A low loss suspended substrate coupler includes a substrate having a first transmission line disposed on a topside of the substrate and a second transmission line disposed on the bottom side of the substrate, thereby providing broadside transmission line coupling. To provide closer mode velocity matching, the coupler has capacitive loading or coupling to ground at discrete intervals between the two transmission lines. The capacitive loading is formed by integrating stubs in each transmission line at pre-determined intervals, each of which is opposite a corresponding one of a plurality of ground stubs on the other side of the substrate. The ground stubs are connected to ground at the outer edge of the coupler area with substrate vias or directly to the coupler housing.

Suspended substrate low loss coupler

A receiver ( ) for a wireless telecommunications system that provides relatively wideband signal processing of received signals without increased signal distortion so that multiple received signals can be simultaneously processed. The receiver ( ) includes a specialized LNA ( ), frequency down-converter ( ) and ADC ( ) to perform the wideband signal processing while maintaining receiver performance. The frequency down-converter ( ) employs a suitable mixer ( ), BPA ( ), attenuator ( ), and transformer ( ) that are tuned to provide the desired frequency down-conversion and amplitude control over the desired wideband. The down-converter devices are selected depending on the particular performance criteria of the ADC ( ). A specialized digital channelizer ( ) is included in the receiver ( ) that receives the digital signal from the ADC ( ), and separates the signals into the multiple channels. In one embodiment, the frequency down-conversion is performed in a single down-conversion process, and the ADC ( ) employs delta-sigma processing to provide digital conversion over the complete frequency band. In an alternate embodiment, the frequency down-conversion is performed in a double down-conversion process so that a less complex ADC ( ) can be used.

Wireless telecommunications multi-carrier receiver architecture

A low noise amplifier topology includes a dual gate transistor device, such as a HEMT device and employs resistive feedback with a DC block associated with the amplifier output to a desired high voltage gain and a low noise figure over a desired range of frequencies.

Dual gate low noise amplifier

Receiver including low noise amplifier and frequency down-converter for a wireless telecommunication system

Multi-carrier receiver for a wireless telecommunication system

A low noise amplifier ( ) for use in a wireless telecommunications system. The amplifier ( ) includes an amplifying device ( ), such as an FET, and a plurality of oscillation stabilization components monolithically integrated on a common substrate ( ). The stabilization components reduce the gain of the amplifying device ( ) at high frequencies to prevent high frequency oscillations. The substrate ( ) is on the order of 4 mils thick, so that the operation of the stabilization components are predictable at high frequencies.

High dynamic range low noise amplifier

An advanced electronics package for integrating electronic components of an electronic circuit, such as RF circuits. An important aspect of the invention relates to the simplicity in forming and integrating the electronic components in the package relative to known electronics packages. In one embodiment of the invention, various ceramic preforms are utilized which may be cast with temperature durable electronic components or formed as interconnect channels or feedthroughs. The preforms, in turn, are adapted to be cast into a composite housing, for example, an aluminum silicon carbide (AlSiC) housing. The component preforms may include resistors, capacitors, and inductors. In addition, RF pins as well as DC pads may be cast in the housing. The electronic components are electrically coupled to an interconnect channel or feedthrough. Interconnections by way of the interconnect channels or feedthroughs within the package may be made by way of metal infusion of a metal, such as aluminum, into the ceramic of the interconnect channels. In an alternate embodiment of the invention, a polymer based integrated package, formed from a polymer, is molded around a cast base which acts as a heat sink. Interconnection between the various electronic components is made by either molding interconnect metal tracings in the polymer housing or by way of interconnection vias which are filled with polymer based conductive paste or immersion plating. In both embodiments, interconnections between electronic components forming the electronic circuit are made without the use of glass feedthroughs which greatly simplifies the cost and complexity of the package.

Method of producing an advanced RF electronic package

An advanced electronics package for integrating electronic components of an electronic circuit, such as RF circuits. An important aspect of the invention relates to the simplicity in forming and integrating the electronic components in the package relative to known electronics packages. In one embodiment of the invention, various ceramic preforms are utilized which may be cast with temperature durable electronic components or formed as interconnect channels or feedthroughs. The preforms, in turn, are adapted to be cast into a composite housing, for example, an aluminum silicon carbide (AlSiC) housing. The component preforms may include resistors, capacitors, and inductors. In addition, RF pins as well as DC pads may be cast in the housing. The electronic components are electrically coupled to an interconnect channel or feedthrough. Interconnections by way of the interconnect channels or feedthroughs within the package may be made by way of metal infusion of a metal, such as alumninum, into the ceramic of the interconnect channels. In an alternate embodiment of the invention, a polymer based integrated package, formed from a polymer, is molded around a cast base which acts as a heat sink. Interconnection between the various electronic components is made by either molding interconnect metal tracings in the polymer housing or by way of interconnection vias which are filled with polymer based conductive paste or immersion plating. In both embodiments, interconnections between electronic components forming the electronic circuit are made without the use of glass feedthroughs which greatly simplifies the cost and complexity of the package.

Growing community of inventors

Rancho Palos Verdes, CA, United States of America

David Joseph Brunone