David J Fryklund

Title: The Innovative Contributions of David J Fryklund

Introduction

David J Fryklund is a notable inventor based in Hampton Falls, NH (US). He has made significant contributions to the field of semiconductor packaging, holding a total of 5 patents. His work focuses on advanced methods for fabricating semiconductor devices, which are crucial for modern electronics.

Latest Patents

Fryklund's latest patents include innovative designs for near chip scale semiconductor packages. One of his notable inventions is the "Flip chip ball grid array semiconductor devices and methods for fabricating the same." This patent describes a method where a semiconductor die is adhered to a substrate in a flip chip configuration. The process involves coating the die with a first polymer layer, selectively removing portions of this layer to expose parts of the die, and depositing a first metal layer that provides electrical contact while also creating an electromagnetic shield around the die. Another patent underlines a similar integration process, emphasizing the efficiency and effectiveness of his designs in semiconductor packaging.

Career Highlights

Throughout his career, Fryklund has worked with prominent companies such as Skyworks Solutions, Inc. and The Whitaker Corporation. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking advancements in semiconductor technology.

Collaborations

Fryklund has collaborated with several talented individuals in the industry, including Alfred H Carl and Brian P Murphy. These partnerships have fostered innovation and have been instrumental in the development of his patented technologies.

Conclusion

David J Fryklund's contributions to semiconductor packaging are noteworthy and reflect his dedication to innovation. His patents not only advance technology but also pave the way for future developments in the field.