Skyworks Solutions, Inc.

The Whitaker Corporation

David J Fryklund

Brian P Murphy

Alfred H Carl

Paul John Schwab

Graham John Wells

Flip chip ball grid array semiconductor devices and methods for fabricating the same. In one example, a near chip scale method of semiconductor die packaging may comprise adhering the die to a substrate in a flip chip configuration, coating the die with a first polymer layer, selectively removing the first polymer layer to provide at least one opening to expose a portion of the die, and depositing a first metal layer over the first polymer layer, the first metal layer at least partially filling the at least one opening to provide an electrical contact to the die, and including a portion that substantially surrounds the die in a plane of an upper surface of the first metal layer to provide an electromagnetic shield around the die.

Near chip scale semiconductor packages

Near chip scale package integration process

A packaged integrated circuit configured for interconnection to an external component comprises a die (1) having a high frequency contact (8), the die (1) being disposed on a lead frame (3). The lead frame (3) comprises a plurality of leads (9). At least two of the leads are first and second RF port leads (9a, 9b) which are electrically connected to the RF port. When mounted to a printed circuit board substrate, there is a capacitor (12) connected between the first and second high frequency contact (8) leads (9a, 9b) to achieve frequency specific signal attenuation at an unwanted frequency with minimal contribution of insertion loss at a desired frequency.

Integrated circuit having a parasitic resonance filter

Growing community of inventors

Hampton Falls, NH, United States of America

David J Fryklund