This inventor holds 2 USPTO granted patents. Top assignee: International Business Machines Corporation. Active years: 1999-2001.
Company Filing History:
Years Active: 1999-2001
Title: David Frederick Diefenderfer: Innovator in Semiconductor Manufacturing
Introduction
David Frederick Diefenderfer is a notable inventor based in Manassas, VA (US). He has made significant contributions to the field of semiconductor manufacturing, holding a total of 2 patents. His work focuses on enhancing the mechanical strength of semiconductor chips through innovative methods.
Latest Patents
Diefenderfer's latest patents include a method and apparatus for preventing chip breakage during semiconductor manufacturing using wafer grinding striation information. This method describes how the mechanical strength of semiconductor device chips can be controlled by appropriate wafer finishing. The sorting of chips is based on knowledge of the finishing method and the geometry of both the chips and wafers. The control and sorting processes derive from an understanding of the geometry of the striations that remain on the back of chips after the wafer-grinding finishing step.
Career Highlights
David Frederick Diefenderfer is currently associated with International Business Machines Corporation (IBM). His work at IBM has allowed him to develop and refine his innovative approaches to semiconductor manufacturing.
Collaborations
Diefenderfer has collaborated with notable colleagues, including Eric Gerhard Liniger and Robert F. Cook. Their combined expertise has contributed to advancements in the semiconductor industry.
Conclusion
David Frederick Diefenderfer's contributions to semiconductor manufacturing through his innovative patents and collaborations highlight his role as a significant inventor in the field. His work continues to influence the industry and improve the reliability of semiconductor devices.