The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 30, 1999
Filed:
Jun. 04, 1998
Applicant:
Inventors:
Ronald Lee Mendelson, Richmond, VT (US);
Robert Francis Cook, Putnam Valley, NY (US);
David Frederick Diefenderfer, Manassas, VA (US);
Eric Gerhard Liniger, Danbury, CT (US);
John M Blondin, Colchester, VT (US);
Donald W Brouillette, St. Albans, VT (US);
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01N / ;
U.S. Cl.
CPC ...
438 15 ; 438 15 ; 438462 ; 438973 ; 148D / ;
Abstract
A method is described by which the mechanical strength of chips of semiconductor devices can be controlled by appropriate wafer finishing and sorted by knowledge of the finishing method and chip and wafer geometry. The control and sorting derive from a knowledge of the geometry of the striations remaining on the back of chips after the wafer-grinding finishing step.