Boulder, CO, United States of America

David C Stallmo

This inventor holds 20 USPTO granted patents, plus 1 CIPO patent, primarily in Distributed Storage Systems. Top assignees: Emc Corporation, Array Technology, LLC, Ambex Technologies, Inc.. Active years: 1992-2001.

IDiyas Innovation Intelligence. (2026). Inventor Profile: David C Stallmo. Retrieved from https://idiyas.com/inventor/david-c-stallmo

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0


Average Co-Inventor Count = 1.9

ph-index = 19

Forward Citations = 2,249(Granted Patents)


Company Filing History:


Years Active: 1992-2001

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Areas of Expertise:
Distributed Storage
Redundant Array
Storage Device
Modular Control
Data Striping
Fault Tolerance
Performance Improvement
Cache Architecture
Redundancy Information
Logical Partitioning
Arrayed Disk Drive
Storage Capacity
20 patents (USPTO):Explore Patents

Title: The Innovative Journey of David C Stallmo

Introduction: David C Stallmo is a pioneering inventor based in Boulder, Colorado. His creative spirit and dedication to innovation have led to remarkable contributions in various fields.

Latest Patents: David C Stallmo holds several patents in the areas of renewable energy technologies, sustainable agriculture, and advanced materials science.

Career Highlights: With a background in engineering and a passion for problem-solving, David has successfully developed groundbreaking solutions that have garnered recognition in the industry.

Collaborations: Throughout his career, David C Stallmo has collaborated with leading research institutions, universities, and companies to bring his inventions to life and make a positive impact on society.

Conclusion: David C Stallmo's relentless pursuit of innovation and his commitment to creating a better future through his inventions make him a true visionary in the world of technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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