This inventor holds 1 USPTO granted patent and 2 published patent applications, plus 2 CIPO patents and 2 EPO patents. Top assignee: Labinal Power Systems. Active years: 2017.
Company Filing History:
Years Active: 2017
Title: David Boutot - Innovator in Electrical Connection Methods
Introduction
David Boutot is a notable inventor based in Lascaux, France. He has made significant contributions to the field of electrical engineering, particularly in the area of flexible bonded connection layers. His innovative approach has led to the development of a unique method for connecting electrical conductors.
Latest Patents
David Boutot holds a patent for a "Method for connecting the conductors of a flexible bonded (equipotential) connection layer." This method involves electrically connecting conductors by crimping them in a connector designed for equipotential connection of a planar and flexible layer formed by the conductors. The process includes positioning the electrical conductors in individual longitudinal and parallel cells formed between two planar walls of the connector. The conductors are crimped in a designated crimping zone through simultaneous transverse punching of at least one wall of the connector. This technique results in the formation of corresponding transverse groove lines on the connector wall, which facilitates the electrical connection of the conductors.
Career Highlights
Throughout his career, David has worked with prominent companies in the industry. He has been associated with Labinal Power Systems and Mecatraction, where he applied his expertise in electrical connections and contributed to various projects.
Collaborations
David has collaborated with several professionals in his field, including Arnaud Camille Ayme and Jean-Luc Biesse. These collaborations have further enriched his experience and innovation in electrical engineering.
Conclusion
David Boutot's contributions to the field of electrical connections demonstrate his innovative spirit and technical expertise. His patented method showcases the potential for advancements in flexible bonded connection technologies.