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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9711925 B1

PDFFull Text
Date of Patent:
Jul. 18, 2017

Filed:

Apr. 18, 2013

Method for connecting the conductors of a flexible bonded (equipotential) connection layer

Applicant:

Labinal Power Systems, Blagnac, FR;

Inventors:

Jean-Luc Biesse, Saint Lieux les Lavaur, FR;

Arnaud Camille Ayme, Toulouse, FR;

Florian Barraud, Meilhac, FR;

David Boutot, Lascaux, FR;

Assignee:

LABINAL POWER SYSTEMS, Blagnac, FR;

Attorney:

Oblon, McClelland, Maier & Neustadt, L.L.P.

Primary Examiner:

A Dexter Tugbang

Int. Cl.
CPC ...
H01R 43/048 (2006.01); H01B 7/04 (2006.01); H01R 43/16 (2006.01); H01R 4/24 (2006.01); H01R 4/20 (2006.01); H01B 7/06 (2006.01); H01R 4/64 (2006.01); H01R 12/69 (2011.01); H01B 5/00 (2006.01); H01B 7/00 (2006.01); H01R 43/042 (2006.01); H01R 4/18 (2006.01); H01R 4/62 (2006.01); H01R 31/08 (2006.01); H01R 101/00 (2006.01);
U.S. Cl.
CPC ...
H01R 43/048 (2013.01); H01B 5/00 (2013.01); H01B 7/0045 (2013.01); H01B 7/04 (2013.01); H01B 7/06 (2013.01); H01R 4/20 (2013.01); H01R 4/206 (2013.01); H01R 4/24 (2013.01); H01R 4/2404 (2013.01); H01R 4/64 (2013.01); H01R 12/69 (2013.01); H01R 43/042 (2013.01); H01R 43/0482 (2013.01); H01R 43/16 (2013.01); H01R 4/182 (2013.01); H01R 4/62 (2013.01); H01R 4/646 (2013.01); H01R 31/085 (2013.01); H01R 2101/00 (2013.01); Y10T 29/49181 (2015.01); Y10T 29/49222 (2015.01); Y10T 29/53209 (2015.01); Y10T 29/53217 (2015.01); Y10T 29/53235 (2015.01); Y10T 29/53239 (2015.01);
Abstract

A method electrically connects by crimping electrical conductors in a connector for equipotential connection of a planar and flexible layer formed by the conductors, to metal components. The method includes positioning the electrical conductors in individual longitudinal and parallel cells which are formed between two planar walls of the connector, crimping the conductors crimped in a crimping zone by simultaneous transverse punching of at least one wall of the connector, and forming by the transverse punching at least one corresponding transverse groove line on the at least one connector wall and, by load transfer, on each of the conductors to electrically connect the conductors.

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