Chandler, AZ, United States of America

David B Lampner

This inventor holds 1 USPTO granted patent. Top assignee: Intel Corporation. Active years: 2020.


Average Co-Inventor Count = 10.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2020

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1 patent (USPTO):Explore Patents

Title: David B Lampner: Innovator in Wearable Technology

Introduction

David B Lampner is a notable inventor based in Chandler, AZ (US). He has made significant contributions to the field of wearable technology, particularly through his innovative patent related to flexible packaging for electronic devices. His work exemplifies the intersection of technology and practicality, addressing the needs of modern consumers.

Latest Patents

David holds a patent for a "Flexible packaging for a wearable electronic device." This patent discloses a stretchable packaging system designed for a wearable electronic device. The system includes a first electronic component and a flexible trace connected to this component. An elastomer layer, which has a variable thickness, at least partially encapsulates both the first electronic component and the flexible trace. Notably, a first region of the layer has a thickness greater than that of a second region, which encapsulates the trace.

Career Highlights

David is currently employed at Intel Corporation, a leading technology company known for its innovations in computing and electronics. His role at Intel allows him to work on cutting-edge projects that push the boundaries of technology.

Collaborations

Throughout his career, David has collaborated with talented individuals such as Aleksandar Aleksov and Son V Nguyen. These collaborations have likely contributed to the development of innovative solutions in the field of wearable technology.

Conclusion

David B Lampner is a prominent figure in the realm of wearable technology, with a focus on creating flexible packaging solutions for electronic devices. His contributions continue to influence the industry and pave the way for future innovations.

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