This inventor holds 1 USPTO granted patent. Top assignee: Stellex Microwave Systems, Inc.. Active years: 2001.
Company Filing History:
Years Active: 2001
Title: David Andrew Verdon: Innovator in Electrical Engineering
Introduction
David Andrew Verdon is a notable inventor based in San Jose, California. He has made significant contributions to the field of electrical engineering, particularly in the design of double-sided modules. His innovative approach has led to advancements that enhance the performance and reliability of electronic components.
Latest Patents
David holds a patent for a "Conductive via feed through for double-sided modules." This invention involves a double-sided module that features electrical substrates on either side of a panel housing. These substrates are interconnected by a wire connection from one substrate to a conductor-filled through-channel, or via, in the other substrate. The design ensures that the distances from the bonding point on one substrate to the bond vias maintain predetermined ratios of heights to center-to-center distances. This is crucial to avoid failure under ultra-high acceleration. Specifically, a ratio of under 20 to 1 is required to prevent failure under 5,000 gravities of acceleration for a 0.0008 inch diameter wire, and under 8.3 to 1 for a 0.002 inch diameter wire.
Career Highlights
David is currently employed at Stellex Microwave Systems, Inc., where he continues to apply his expertise in electrical engineering. His work focuses on developing innovative solutions that meet the demands of modern technology.
Collaborations
David has collaborated with several talented individuals in his field, including Eric F Richardson and Brett Armstrong Kelley. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of cutting-edge technologies.
Conclusion
David Andrew Verdon is a distinguished inventor whose work in electrical engineering has led to significant advancements in double-sided module technology. His innovative patent demonstrates his commitment to enhancing the reliability of electronic components. His contributions continue to impact the industry positively.