The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 11, 2001
Filed:
May. 12, 1999
Eric Franklyn Richardson, Sunnyvale, CA (US);
David Andrew Verdon, San Jose, CA (US);
Brett Armstrong Kelley, Redwood City, CA (US);
Stellex Microwave Systems, Inc., Palo Alto, CA (US);
Abstract
A double-sided module is provided having electrical substrates on either side of a panel housing which are interconnected by a wire connection from one substrate to a conductor-filled through-channel, or via, in the other substrate. The distances from the bonding point on one substrate to the bond vias have to have predetermined ratios of heights to center-to-center distances to avoid failure under ultra high acceleration. A ratio of under 20 to 1 is required to avoid failure under 5,000 gravities of acceleration for a 0.0008 inch diameter wire and under 8.3 to 1 for a 0.002 inch diameter wire.