David A Smith

Title: Innovations and Achievements of David A. Smith in Integrated Circuit Technology

Introduction

David A. Smith, a prominent inventor based in Hong Kong, China, has made significant contributions to the field of semiconductor technology. With a remarkable portfolio of 20 patents, Smith has focused on developing advanced integrated circuit (IC) mounting structures, showcasing his expertise and innovative mindset in the industry.

Latest Patents

Among his latest inventions are two notable patents related to integrated circuit mounting structures featuring switching power supplies. The first patent discloses a semiconductor packaging structure that includes a hybrid IC package with at least one IC chip. It incorporates a DC-DC switching power supply mounted within the package, electrically coupled to the IC chip through conductive paths. This design allows the power supply to receive energy from a remote power source, supplying the required voltage to the IC chip seamlessly.

The second patent presents a mounting structure designed to provide direct current (DC) power to an IC package. This innovative structure comprises a socket for receiving an IC package containing one or more IC chips and integrates a power supply tailored to deliver a specified DC voltage. The power supply is effectively coupled to the IC package via conductive paths formed in the socket, enhancing the reliability and efficiency of the power delivery system.

Career Highlights

David A. Smith is currently employed at Astec International Limited, where he continues to innovate and refine technologies in the realm of integrated circuits and power supplies. His extensive experience and dedication to advancing semiconductor technology have positioned him as a key player in his field.

Collaborations

Throughout his career, Smith has had the opportunity to collaborate with distinguished colleagues such as Neal George Stewart and Carl E. Arvidsson. These partnerships have further fueled innovative breakthroughs and contributed to successful project outcomes in their respective domains.

Conclusion

With 20 patents to his name and a strong background in integrated circuit technology, David A. Smith stands out as an influential inventor in Hong Kong's semiconductor industry. His latest innovations illustrate a commitment to enhancing the efficiency of power distribution in integrated circuits. Through his work at Astec International Limited and collaborations with fellow inventors, Smith continues to push the boundaries of technology, paving the way for future advancements in the field.