The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 22, 2002
Filed:
Apr. 23, 1997
Applicant:
Inventors:
David Anthony Smith, Sai Kung, HK;
Neal G. Stewart, Sai Kung, HK;
Assignee:
Astec International Limited, Hong Kong, HK;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 ;
U.S. Cl.
CPC ...
H05K 7/20 ;
Abstract
A semiconductor packaging structure comprising a hybrid IC package having at least one IC chip mounted therein is disclosed. The semiconductor packaging structure includes a DC-DC switching power supply mounted within the hybrid IC package that is electrically coupled to at least one of the IC chips by conductive paths formed in said hybrid IC package for supplying at least one specified voltage to the at least one IC chip. Power is supplied to the DC-DC switching power supply from a remote power source.