The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 17, 1995
Filed:
May. 24, 1991
David A Smith, Kowloon, HK;
Astec International, Ltd., , HK;
Abstract
The present invention provides a heat sink and electromagnetic interference shield assembly for a plurality of semiconductor elements. The semiconductor elements are connected with other circuit elements to form an electrical circuit. Each semiconductor element has a metal portion for dissipating heat generated by the semiconductor element. The metal portion also emits electrical energy as a result of the operation of the semiconductor element thereby causing unwanted electromagnetic interference. The assembly comprises an insulator attached to the meted portion of the semiconductor element and a substrate for mounting the plurality of semiconductor elements. The insulator is of a thermally conductive material to facilitate the conduction of thermal energy away from the semiconductor element. The substrate has a metal base layer, a middle insulating layer, and a plurality of metal mounting areas for mounting the plurality of semiconductor elements. The electrical energy emitted by each semiconductor element is capacitively coupled to its corresponding metal mounting area. The assembly also contains a conductive path for returning the electrical energy coupled to the metal mounting area to one of the circuit elements such that the amount of electromagnetic interference is reduced.