Woodbury, CT, United States of America

David A Sawoska


Average Co-Inventor Count = 4.0

ph-index = 2

Forward Citations = 46(Granted Patents)


Company Filing History:


Years Active: 1980-1981

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2 patents (USPTO):Explore Patents

Title: Innovations in Electroless Copper Deposition by David A. Sawoska

Introduction

David A. Sawoska is an accomplished inventor based in Woodbury, CT (US). He has made significant contributions to the field of electroless copper deposition, holding 2 patents that enhance the stability and efficiency of copper plating processes.

Latest Patents

His latest patents focus on electroless copper deposition solutions that utilize hypophosphite reducing agents. These solutions are designed to replace traditional formaldehyde-type reducing agents, providing a more stable and effective method for depositing metallic copper onto workpieces. The innovative approach involves coordinating complexing agents and bath pH to achieve satisfactory copper deposition over extended periods, even amidst fluctuations in component concentration and bath temperatures.

Career Highlights

David A. Sawoska is associated with Macdermid, Incorporated, where he has applied his expertise in developing advanced electroless copper solutions. His work has led to improvements in the longevity and reliability of copper deposition processes, making significant strides in the industry.

Collaborations

He has collaborated with notable coworkers, including Peter E. Kukanskis and John J. Grunwald, contributing to the advancement of electroless copper technologies.

Conclusion

David A. Sawoska's innovations in electroless copper deposition represent a significant advancement in the field, showcasing his commitment to improving industrial processes. His contributions continue to influence the effectiveness and stability of copper plating solutions.

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