Norristown, PA, United States of America

David A Leonhardt


Average Co-Inventor Count = 3.3

ph-index = 3

Forward Citations = 140(Granted Patents)


Company Filing History:


Years Active: 1986-1988

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3 patents (USPTO):Explore Patents

Title: Innovations by David A. Leonhardt

Introduction

David A. Leonhardt is an accomplished inventor based in Norristown, PA (US). He holds a total of 3 patents that showcase his expertise in the field of bonding technology. His innovative contributions have significantly advanced the capabilities of wire bonding processes in semiconductor manufacturing.

Latest Patents

One of his notable patents is the "Apparatus for supplying uniform tail lengths." This invention features a novel monitoring and detecting circuit designed for an automatic wedge wire bonder. The circuit is activated during the second wire bond process, ensuring that if the bonding wire is absent, a signal is generated to halt the operation of the wire bonder. This mechanism allows for precise control over the elongation of the bonding wire, ensuring uniform tail lengths are maintained.

Another significant patent is the "Automatic wire feed system." This system enhances the efficiency of supplying fine wire to bonding tools. It includes a unique wire feed slack loop device that utilizes compressed air to maintain the wire's shape and position. This innovation prevents tension or compression of the wire at the bonding tool, facilitating seamless interconnections on semiconductor devices.

Career Highlights

David has worked with prominent companies in the industry, including Kulicke and Soffa Industries, Inc. and Kulicke & Soffa Ind. Inc. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking advancements in wire bonding technology.

Collaborations

Throughout his career, David has collaborated with notable professionals such as Gary S. Gillotti and Frederick W. Kulicke, Jr. These partnerships have fostered an environment of innovation and have led to the development of several key technologies in the field.

Conclusion

David A. Leonhardt's contributions to the field of bonding technology are significant and impactful. His patents reflect a commitment to innovation and excellence in semiconductor manufacturing processes. His work continues to influence the industry and inspire future advancements.

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