The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 28, 1986

Filed:

Oct. 04, 1985
Applicant:
Inventors:

Vincent G Amorosi, Horsham, PA (US);

Gautam N Shah, Warrington, PA (US);

Mark B Soffa, Philadelphia, PA (US);

David A Leonhardt, Norristown, PA (US);

Gary L Gillman, Warminister, PA (US);

Assignee:

Kulicke and Soffa Industries, Inc., Willow Grove, PA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K / ;
U.S. Cl.
CPC ...
228-45 ; 228-62 ; 228 447 ; 228 491 ;
Abstract

The present invention provides a new and improved workstation for holding a semiconductor device opposite the bonding tool of an automatic wire bonder during a bonding operation. The workstation is mounted on a retractable pedestal which is vertically and rotationally movable by a high speed vertical axis drive motor and a high speed theta drive motor which are mounted on a workstation base in fixed positions and coupled to said pedestal for imparting motion thereto. The movable pedestal and workstation are adapted to unload a semiconductor device from a boat or holder and accurately position the top of the semiconductor device at a predetermined bonding height opposite the bonding tool. The workstation and pedestal are retractable to return the semiconductor device to the holder and the control means are adapted to move the holder horizontally to index a new semiconductor device over the workstation prior to the semiconductor device being unloaded from the holder and positioned opposite the bonding tool of an automatic wire bonder.


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