Taichung, Taiwan

Daven Chang

This inventor holds 1 USPTO granted patent. Top assignee: Power Mate Technology Co., Ltd.. Active years: 2004.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Daven Chang. Retrieved from https://idiyas.com/inventor/daven-chang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 14(Granted Patents)


Company Filing History:


Years Active: 2004

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1 patent (USPTO):Explore Patents

Title: Daven Chang: Innovator in Heat-Dissipating Technology

Introduction

Daven Chang is a notable inventor based in Taichung, Taiwan. He has made significant contributions to the field of electronic components through his innovative designs. His work focuses on enhancing the efficiency and performance of circuit boards.

Latest Patents

Daven Chang holds 1 patent for his invention titled "Heat-dissipating structure of circuit board." This patent describes a heat-dissipating circuit board assembly that includes a heat-conducting base board and a circuit board. The assembly is designed to effectively manage heat generated by electronic components, ensuring optimal performance and longevity.

Career Highlights

Daven Chang is currently employed at Power Mate Technology Co., Ltd. His role involves developing advanced technologies that improve electronic device functionality. His expertise in heat management solutions has positioned him as a key player in the industry.

Collaborations

Daven has collaborated with talented individuals such as Lien-Hing Chen and Aaron Tsai. These partnerships have fostered innovation and creativity in their projects.

Conclusion

Daven Chang's contributions to heat-dissipating technology exemplify his commitment to innovation in the electronics field. His patent reflects a significant advancement in circuit board design, showcasing his expertise and dedication to improving electronic performance.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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