The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 06, 2004
Filed:
Mar. 25, 2003
Power Mate Technology Co., Ltd., Taichung, TW;
Abstract
A heat-dissipating circuit board assembly is composed of a heat-conducting base board and a circuit board. The heat-conducting base board includes an insulating heat-conducting layer disposed thereon and a plurality of bonding pads disposed on the insulating heat-conducting layer and never connected with one another. The circuit board that is single-layered or multiple-layered includes a plurality of electronic components at at least one side thereof and a plurality of heat-dissipating zones at a side thereof. The heat-dissipating zones are connected with heat-generating elements of the electronic components and in a corresponding position to the bonding pads. The heat-conducting base board is connected with the heat-conducting base board by the melted bonding pads that are melted by heating and further disposed therebetween.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile