Hyderabad Telangana, India

Dasarapu Vinay Kumar

This inventor holds 1 USPTO granted patent. Top assignee: Synopsys, Inc.. Active years: 2014.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Dasarapu Vinay Kumar. Retrieved from https://idiyas.com/inventor/dasarapu-vinay-kumar

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2014

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1 patent (USPTO):Explore Patents

Title: Dasarapu Vinay Kumar and Layout-Dependent Mechanical Modeling

Introduction

Dasarapu Vinay Kumar is an inventor based in Hyderabad, Telangana, India. His patent work concerns modeling the mechanical behavior of integrated circuits, with a focus on how layout-dependent material properties affect their response to thermal stresses.

Latest Patents

The provided information lists one patent for Kumar: “Modeling Mechanical Behavior with Layout-Dependent Material Properties.” The patent describes computer-implemented techniques for simulating the mechanical behavior of integrated circuits during repeated heating and cooling cycles associated with packaging and operation.

The methods extract structural information about back-end-of-line (BEOL) wiring, vias, and insulating materials. They use that information to calculate layout-dependent material volume fractions and determine anisotropic mechanical properties. The resulting material properties and volume fractions are then used to calculate mechanical responses across the integrated circuit.

Career Highlights

Kumar is associated with Synopsys, Inc., a company whose work includes electronic design automation and semiconductor design technologies. His patent reflects an approach to analyzing how integrated-circuit layout and material composition influence mechanical behavior.

Collaborations

The provided information identifies Xi-Wei Lin and Xiaopeng Xu as Kumar’s coworkers. Their names are associated with his professional context, though specific collaborative roles in the patent are not stated.

Conclusion

Dasarapu Vinay Kumar’s listed patent addresses the simulation of integrated-circuit mechanical behavior by accounting for layout-dependent material properties and thermal cycling.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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