Darius K Deak

Title: Darius K Deak: Innovator in Adhesive Technologies

Introduction

Darius K Deak is a notable inventor based in Haverhill, MA (US), recognized for his contributions to adhesive technologies. With a total of three patents to his name, he has made significant advancements in the field of hot melt adhesives and heat seal coatings.

Latest Patents

Darius's latest patents include innovative formulations that enhance the performance of adhesives. One of his patents focuses on styrene-based materials for hot melt adhesives. This invention comprises a polymer selection that includes polystyrene, polybutene, and various other polymers, combined with a tackifying resin and precisely end-capped polystyrene (PECPS). This formulation aims to improve compatibility with commonly used polymers and block copolymers in adhesive applications. Another significant patent is for a solvent-based low temperature heat seal coating. This coating solution contains a polyester or co-polyester resin, tackifier, anti-blocking agent, and solvent. It can be applied to packaging webs using conventional methods, allowing for the manufacture of food packaging bags or pharmaceutical blister packaging at low heat seal temperatures.

Career Highlights

Darius K Deak is currently employed at Bostik, Inc., a company known for its innovative adhesive solutions. His work at Bostik has allowed him to develop and patent technologies that are crucial for various industrial applications.

Collaborations

Throughout his career, Darius has collaborated with talented individuals such as Thomas Lee Ruppert and Elaine Lo. These collaborations have contributed to the successful development of his patented technologies.

Conclusion

Darius K Deak's contributions to adhesive technologies through his patents reflect his innovative spirit and dedication to improving industrial applications. His work continues to influence the field of adhesives, showcasing the importance of innovation in this sector.