Menlo Park, CA, United States of America

Darin Olsen


Average Co-Inventor Count = 10.0

ph-index = 1

Forward Citations = 7(Granted Patents)


Company Filing History:


Years Active: 2011

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1 patent (USPTO):Explore Patents

Title: The Innovations of Darin Olsen in Thermal Interface Materials

Introduction: Darin Olsen, an innovative inventor based in Menlo Park, California, has made significant contributions to the field of thermal management in electronic devices. With a focus on carbon nanotube-based structures, his work aims to enhance the efficiency and performance of solid-state devices by effectively removing heat.

Latest Patents: Darin Olsen holds a patent for "Carbon nanotube-based structures and methods for removing heat from solid-state devices." This groundbreaking invention features a copper substrate topped with a catalyst. The thermal interface material incorporates a layer of carbon nanotubes that are oriented perpendicular to the copper surface, resulting in improved thermal conductivity. Key characteristics of the material include a bulk thermal resistance and specific contact resistances at the interfaces between the thermal material and the copper substrate, as well as between the thermal material and solid-state devices. Notably, the summation of these resistances achieves a remarkable value of 0.06 cmK/W or less, which underscores the effectiveness of this innovation.

Career Highlights: Darin Olsen is currently employed at Samsung Electronics Co., Ltd., where he continues to explore advanced materials and solutions for thermal management in electronic devices. His expertise in combining cutting-edge technology with practical applications positions him as a valuable asset in the ever-evolving landscape of electronics.

Collaborations: Throughout his career, Darin has collaborated with esteemed colleagues like Carlos Dangelo and Ephraim Suhir. These partnerships have allowed for the exchange of ideas and the development of innovative solutions to complex engineering challenges in thermal management.

Conclusion: Darin Olsen's contributions to the realm of thermal interface materials have the potential to revolutionize the performance of solid-state devices. His innovative approach and commitment to excellence exemplify the spirit of invention, making him a noteworthy figure in the field of thermal management technology. As he continues to develop new solutions, his work will likely play a crucial role in advancing the capabilities of electronic devices.

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