Darin Miller

Title: Darin Miller: Innovator in Conductive Interconnects

Introduction

Darin Miller is a notable inventor based in Boise, ID (US). He has made significant contributions to the field of conductive interconnects, holding a total of 5 patents. His work focuses on innovative methods for forming integrated assemblies that enhance electronic connectivity.

Latest Patents

One of Darin's latest patents involves the development of conductive interconnects and methods of forming them. This patent describes a method that includes forming an arrangement with a conductive pillar extending through an insulative mass. The upper surface of the conductive pillar is recessed to create a cavity, and an insulative collar is formed within this cavity to line its outer lateral periphery. The recessed surface of the conductive pillar is exposed at the bottom of the lined cavity. A conductive expanse is then formed over the insulative mass, with a portion extending into the cavity and configured as an interconnect. The conductive expanse is patterned into multiple conductive structures, one of which includes the interconnect.

Career Highlights

Darin Miller is currently employed at Micron Technology Incorporated, where he continues to innovate in the field of electronics. His work has been instrumental in advancing technologies that rely on effective conductive interconnects.

Collaborations

Darin has collaborated with several talented individuals, including Todd Albertson and Mark Francis Anderson. These collaborations have contributed to the successful development of his innovative projects.

Conclusion

Darin Miller's contributions to the field of conductive interconnects demonstrate his commitment to innovation and excellence. His patents reflect a deep understanding of electronic assembly methods, positioning him as a key figure in the industry.