Company Filing History:
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1 out of 10 Years Active: 2025
Title: Dapeng Yan: Innovator in Chiplet Testing Technology
Introduction
Dapeng Yan is a notable inventor based in Jiangsu, China. He has made significant contributions to the field of chiplet testing technology. His innovative approach has led to the development of a unique patent that enhances the efficiency of testing multiple chiplets.
Latest Patents
Dapeng Yan holds a patent for a "Universal Test Chiplet." This invention provides a universal test chiplet designed for testing a plurality of chiplets. The universal test chiplet comprises several modules, including a chiplet test control circuit module, a test data distribution circuit module, a memory test configuration circuit module, and a chiplet test interface circuit module. The chiplet test control circuit module is responsible for providing test data and configuring test modes for the chiplets. The test data distribution circuit module distributes the necessary test data from a test data bus to each chiplet. The memory test configuration circuit module offers test circuits for the chiplets' memories and automatically generates a test vector. Finally, the chiplet test interface circuit module transmits the test data to the chiplets in any direction through chiplet test interfaces.
Career Highlights
Dapeng Yan has worked at prominent institutions, including Nanjing University of Posts and Telecommunications and the Nantong Institute of Nanjing University of Posts and Telecommunications Co., Ltd. His work in these organizations has allowed him to develop and refine his innovative ideas in chiplet technology.
Collaborations
Dapeng Yan has collaborated with notable colleagues, including Zhikuang Cai and Xiaoting Liu. Their joint efforts have contributed to advancements in the field of chiplet testing.
Conclusion
Dapeng Yan's contributions to chiplet testing technology through his patent and collaborative efforts highlight his role as an influential inventor in the field. His work continues to pave the way for advancements in testing methodologies for chiplets.