Zhongli, China

Danny Wu

This inventor holds 2 USPTO granted patents. Top assignee: Other. Active years: 1999-2003.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Danny Wu. Retrieved from https://idiyas.com/inventor/danny-wu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 50.0

Average Co-Inventor Count = 1.5

ph-index = 1

Forward Citations = 6(Granted Patents)


Location History:

  • Hsin-Chu, TW (1999)
  • Chung Li City, Taoyuan Hsien, TW (2003)

Company Filing History:

goldMedal2 out of 834,570 
Other
 patents

Years Active: 1999-2003

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2 patents (USPTO):Explore Patents

Title: Innovations of Danny Wu

Introduction

Danny Wu is a notable inventor based in Chungli, CN. He has made significant contributions to the field of electroplating and semiconductor technology. With a total of 2 patents, his work showcases his innovative approach to solving complex engineering challenges.

Latest Patents

One of Danny Wu's latest patents is an "Electroplating apparatus for wheel disk." This invention comprises an electrolytic cell containing an electrolytic bath, a cathode plate, an auxiliary anode, at least one anode plate, and a driving mechanism. The design includes an insulating shielding on part of the auxiliary anode, allowing it to pass through the center hole of the disk wheel. This configuration enables the auxiliary anode to work in conjunction with the anode plate, ensuring complete and smooth plating while preventing tip-discharging through the rotation of the wheel disk.

Another significant patent is the "Method for forming a VIA in an inter metal dielectric (IMD) containing Spin On Glass (SOG)." This method involves a series of steps, including the deposition of a first silicon dioxide layer through a Chemical Vapor Deposition (CVD) process, followed by a Spin On Glass (SOG) layer, and a second silicon dioxide layer. A selective ion implantation process is then performed to densify the SOG layer, effectively preventing outgassing during subsequent metal deposition.

Career Highlights

Danny Wu has established himself as a skilled inventor with a focus on practical applications of his technologies. His patents reflect a deep understanding of both electroplating and semiconductor processes, contributing to advancements in these fields.

Collaborations

Danny has worked alongside talented individuals such as Tuby Tu and Kuang-Chao Chen. Their collaborative efforts have likely enhanced the innovative outcomes of their projects.

Conclusion

Danny Wu's contributions to innovation through his patents demonstrate his expertise and commitment to advancing technology. His work continues to influence the fields of electroplating and semiconductor manufacturing.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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