The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 14, 1999

Filed:

Apr. 14, 1998
Applicant:
Inventors:

Tuby Tu, Hsin-Chu, TW;

Danny Wu, Hsin-Chu, TW;

Kuang-Chao Chen, Hsin-Chu, TW;

Assignee:

Other;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
438782 ; 438640 ; 438632 ; 438624 ; 438780 ; 438790 ; 438673 ;
Abstract

The present invention relates to a method for forming a VIA in an Inter Metal Dielectric (IMD) containing Spin On Glass (SOG). The IMD is formed by 1) depositing a first silicon dioxide layer through a Chemical Vapor Deposition (CVD) process; 2) depositing a Spin On Glass (SOG) layer; and 3) depositing a second silicon dioxide layer through a Chemical Vapor Deposition process. Afterward, before the VIA is formed by an Inter Metal Dielectric (IMD) etching process, a selective ion implantation process is performed to densify the Spin On Glass(SOG) layer. By this arrangement, the outgassing effect of the Spin On Glass (SOG) during a subsequent metal deposition process can be therefore prevented.


Find Patent Forward Citations

Tu, Tuby. (1999). Method for forming a via in an inter metal dielectric (imd) containing (U.S. Patent No. 6001745). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6001745

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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