This inventor holds 2 USPTO granted patents. Top assignee: International Business Machines Corporation. Active years: 2011-2014.
Company Filing History:
Years Active: 2011-2014
Title: The Innovative Contributions of Danielle L DeGraw
Introduction
Danielle L DeGraw, a prominent inventor based in Hyde Park, NY, has made significant strides in the field of technology through her innovative inventions. With a total of two patents to her name, her work has been instrumental in improving methods and processes within the electronics industry.
Latest Patents
Danielle's latest patents showcase her expertise and forward-thinking approach. The first patent, titled "Forming features on a substrate having varying feature densities," details a method for enhancing the manufacturing process of electronic components. This method includes forming a cavity in a substrate, depositing a layer of conductive material, and utilizing a planarizing process followed by a reactive ion etch to achieve desired outcomes.
The second patent, "Metal adhesion by induced surface roughness," addresses a critical issue in silicon wafer processing. This invention prevents backside metal delamination during chip dicing by roughening the polished silicon surface at chip edges, ensuring the integrity of Thru-Silicon-Via (TSV) structures used in 3D chip integration while maintaining reliable conductivity for the backside metal layer.
Career Highlights
Danielle is currently employed at International Business Machines Corporation (IBM), a renowned leader in technological innovation. Her role at IBM allows her to work at the forefront of research and development, contributing to advancements that have a lasting impact on the electronics industry.
Collaborations
Throughout her career, Danielle has collaborated with notable colleagues, including Peter James Lindgren and Da-Yuan Shih. These partnerships not only enhance her innovative capabilities but also foster an environment of creativity and collaboration in their projects.
Conclusion
Danielle L DeGraw exemplifies the spirit of innovation through her impactful patents and collaborative efforts at IBM. Her contributions to technology continue to pave the way for advancements in electronic manufacturing processes, establishing her as a key figure in her field. As she continues her work, the technology community eagerly anticipates her future inventions and their potential to revolutionize the industry.