Avoca, NY, United States of America

Daniel Wayne Levesque, Jr

USPTO Granted Patents = 6 

 

Average Co-Inventor Count = 4.4

ph-index = 2

Forward Citations = 9(Granted Patents)


Location History:

  • Bath, NY (US) (2018)
  • Avoca, NY (US) (2018 - 2023)

Company Filing History:


Years Active: 2018-2023

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6 patents (USPTO):Explore Patents

Title: The Innovative Mind of Daniel Wayne Levesque, Jr.

Introduction: Daniel Wayne Levesque, Jr. is an inventive force based in Avoca, NY, who has significantly contributed to the fields of noise abatement and semiconductor technology. With a portfolio of six patents, his work demonstrates a commitment to pushing the boundaries of innovation.

Latest Patents: Levesque's recent patents include groundbreaking developments in micro-perforated panel systems and inorganics technology. His first notable patent details a micro-perforated panel system designed for noise reduction. This invention outlines methods for creating a glass micro-perforated panel that effectively mitigates sound. The second patent focuses on an inorganic wafer with through-holes bonded to a semiconductor wafer. This innovative process harnesses laser technology to form damage tracks and subsequently enlarge them to create holes throughout the inorganic wafer, effectively merging two crucial materials in semiconductor applications.

Career Highlights: Currently, Levesque is affiliated with Corning Incorporated, a leader in specialty glass and ceramics. His role at Corning has provided him with the platform to develop high-impact technologies that address contemporary challenges in various industries.

Collaborations: Throughout his career, Levesque has worked alongside talented individuals, including his coworkers Garrett Andrew Piech and Aric Bruce Shorey. Collaborating with such professionals has allowed for an exchange of ideas and expertise, fostering an environment ripe for innovation.

Conclusion: Daniel Wayne Levesque, Jr. exemplifies the spirit of innovation through his impressive patents and contributions to leading-edge technology. As he continues to push the envelope at Corning Incorporated, the impact of his work is likely to resonate across industries, paving the way for future advancements and solutions.

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