The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 18, 2018

Filed:

Jun. 09, 2016
Applicant:

Corning Incorporated, Corning, NY (US);

Inventors:

Thomas Michael Castle, Horseheads, NY (US);

Tian Huang, Painted Post, NY (US);

Yuhui Jin, Painted Post, NY (US);

Daniel Wayne Levesque, Jr., Bath, NY (US);

Tammy Lynn Petriwsky, Elmira, NY (US);

Assignee:

Corning Incorporated, Corning, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C03C 23/00 (2006.01); C03C 15/00 (2006.01); B23K 26/382 (2014.01); B23K 26/40 (2014.01); B23K 26/0622 (2014.01); B23K 26/384 (2014.01); B23K 103/00 (2006.01); C03C 4/00 (2006.01); B23K 101/40 (2006.01); H01L 21/48 (2006.01); H01L 23/15 (2006.01);
U.S. Cl.
CPC ...
C03C 15/00 (2013.01); B23K 26/0622 (2015.10); B23K 26/382 (2015.10); B23K 26/384 (2015.10); B23K 26/40 (2013.01); C03C 23/0025 (2013.01); B23K 2201/40 (2013.01); B23K 2203/50 (2015.10); B23K 2203/54 (2015.10); C03C 4/0071 (2013.01); H01L 21/4807 (2013.01); H01L 23/15 (2013.01); Y10T 428/24182 (2015.01); Y10T 428/24273 (2015.01); Y10T 428/24479 (2015.01); Y10T 428/24777 (2015.01);
Abstract

A method of forming a glass substrate includes providing a glass substrate having alumina, translating a pulsed laser beam on the glass substrate to form one or more pilot holes, contacting the glass substrate with an etching solution, and providing agitation. The etching solution has a pH from about 0 to about 2.0, and an etch rate is less than about 3 μm/min. A glass substrate is disclosed having a first surface and a second surface opposite the first surface in a thickness direction, and at least one hole penetrating the first surface, wherein the at least one hole has been etched by an etching solution. A greatest distance dbetween (1) a first plane that contacts the first surface in regions that do not have the at least one hole or a deviation in a thickness of the substrate surrounding the at least one hole and (2) a surface of the deviation recessed from the first plane is less than or equal to about 0.2 μm.


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