The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 30, 2019
Filed:
Sep. 06, 2017
Corning Incorporated, Corning, NY (US);
Andres Covarrubias Jaramillo, Corning, NY (US);
Yuhui Jin, Painted Post, NY (US);
Frank Andrew Kramer, IV, Corning, NY (US);
Ekaterina Aleksandrovna Kuksenkova, Painted Post, NY (US);
Daniel Wayne Levesque, Jr., Avoca, NY (US);
Garrett Andrew Piech, Corning, NY (US);
Aric Bruce Shorey, Pittsford, NY (US);
Robert Stephen Wagner, Corning, NY (US);
Corning Incorporated, Corning, NY (US);
Abstract
Articles including a glass-based substrate with holes, semiconductor packages including an article with holes, and methods of fabricating holes in a substrate are disclosed. In one embodiment, an article includes a glass-based substrate having a first surface, a second surface, and at least one hole extending from the first surface. The at least one hole has an interior wall having a surface roughness Rthat is less than or equal to 1 μm. The at least one hole has a first opening having a first diameter that is present the first surface. A first plane is defined by the first surface of the glass-based substrate based on an average thickness of the glass-based substrate. A ratio of a depression depth to the first diameter of the at least one hole is less than or equal to 0.007.