Daniel T Rooney

Title: The Innovative Contributions of Daniel T. Rooney

Introduction

Daniel T. Rooney is a notable inventor based in Schaumburg, IL (US). He has made significant contributions to the field of electronics, particularly in the area of integrated circuit packaging. With a total of three patents to his name, Rooney's work has had a meaningful impact on the industry.

Latest Patents

Rooney's latest patents include a process to reform a plastic packaged integrated circuit die. This innovative process involves grinding away the bottom side of a plastic package and portions of a set of leads until a bottom surface of the inner portion of the leads is exposed. The method also includes cutting perpendicularly to remove excess portions of the plastic package and adapting the bottom surfaces for reliable electrical connections. Another significant patent is for an overmolded electronic assembly, which is fabricated from overmoldable interface components. These components may include electrical contacts or electronic components with physical interfaces, such as speakers or sensors. The design allows for a sealed cavity within the assembly, enhancing its functionality.

Career Highlights

Rooney is currently employed at Motorola Corporation, where he continues to innovate and develop new technologies. His work at Motorola has positioned him as a key player in the advancement of electronic assembly techniques.

Collaborations

Throughout his career, Rooney has collaborated with notable colleagues, including Jeffrey M. Petsinger and Timothy B. Dean. These collaborations have further enriched his contributions to the field.

Conclusion

Daniel T. Rooney's inventive spirit and dedication to advancing electronic technologies have led to significant innovations in integrated circuit packaging. His patents reflect a commitment to improving the reliability and functionality of electronic assemblies.