The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 14, 2008
Filed:
Jun. 05, 2006
Timothy B. Dean, Elk Grove Village, IL (US);
Bruce C. Deemer, Elk Grove Village, IL (US);
Daniel T. Rooney, Schaumburg, IL (US);
Timothy B. Dean, Elk Grove Village, IL (US);
Bruce C. Deemer, Elk Grove Village, IL (US);
Daniel T. Rooney, Schaumburg, IL (US);
Motorola, Inc., Schaumburg, IL (US);
Abstract
A process for reforming a plastic packaged integrated circuit die () includes grinding away () a bottom side () of a plastic package () and portions of a set of leads () that are in the plane of the grinding until a bottom surface () of an inner portion () of the set of leads is exposed at a peripheral region () of the inner portion, cutting () approximately perpendicularly to the top and bottom sides to remove portions of the plastic package and the set of leads that are outside the inner portion of the set of leads, and adapting () the bottom surfaces of the inner portion of the set of leads for reliable electrical connections.