Motorola Corporation

Daniel T Rooney

Timothy B Dean

Jeffrey M Petsinger

Bruce C Deemer

C Gregory Bujalski

A process for reforming a plastic packaged integrated circuit die () includes grinding away () a bottom side () of a plastic package () and portions of a set of leads () that are in the plane of the grinding until a bottom surface () of an inner portion () of the set of leads is exposed at a peripheral region () of the inner portion, cutting () approximately perpendicularly to the top and bottom sides to remove portions of the plastic package and the set of leads that are outside the inner portion of the set of leads, and adapting () the bottom surfaces of the inner portion of the set of leads for reliable electrical connections.

Process to reform a plastic packaged integrated circuit die

An overmolded electronic assembly () is fabricated from one or more overmoldable interface components () that may be electrical contacts or electronic components that have physical interfaces, such as speakers or sensors. The overmoldable interface components have a sacrificial end that is cut off from the remainder of the overmoldable interface components after being overmolded in an electronic assembly, providing a sealed cavity into the overmolded electronic assembly.

Overmolded electronic assembly and overmoldable interface component

A multi-board electronic assembly (10) includes a first substrate (12) and a second substrate (14) electrically connected by a spacer (16). The spacer (16) includes a first end (26) that is received in a first receptacle (18) on the first substrate (12) and a second end (28) that is received in a second receptacle (22) in the second substrate (14). The spacer (16) is formed generally of a nonconductive body (15) and includes ridges (60) and longitudinal channels (30) defined between the ridges (60). The ridges (60) are formed generally of a nonconductive material, and the spacer (16) includes a metallic strip (32) disposed within the channel (30). The metallic strip (32) forms a conductive path to connect the first circuit trace (20) to the second circuit trace (24) to form an electrically connected microelectronic assembly (10).

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Schaumburg, IL, United States of America

Daniel T Rooney