Daniel P Buergi

Title: Innovations by Daniel P Buergi

Introduction

Daniel P Buergi is an accomplished inventor based in Chalfont, PA (US). He has made significant contributions to the field of semiconductor bonding technology. With a total of 4 patents to his name, Buergi has developed innovative tools and methods that enhance the efficiency and effectiveness of bonding processes.

Latest Patents

Buergi's latest patents include advancements in bonding and placement tools for bonding machines. One notable invention is a bonding tool designed for bonding a semiconductor element to a substrate on a bonding machine. This tool features a body portion with a contact region that interacts with the semiconductor element during the bonding process. Additionally, the body portion includes a non-contact region adjacent to the contact region, which is coated with a heat-resistant material. Another patent focuses on methods of operating bonding machines, detailing a process that involves carrying a semiconductor element with a transfer tool and transferring it to a bonding tool without simultaneous contact from both tools.

Career Highlights

Daniel P Buergi is currently employed at Kulicke and Soffa Industries, Inc., where he continues to innovate in the semiconductor industry. His work has been instrumental in developing technologies that improve the performance and reliability of bonding machines.

Collaborations

Throughout his career, Buergi has collaborated with notable colleagues, including Thomas J Colosimo, Jr and Matthew B Wasserman. These partnerships have contributed to the advancement of bonding technologies and have fostered a collaborative environment for innovation.

Conclusion

Daniel P Buergi's contributions to semiconductor bonding technology through his patents and work at Kulicke and Soffa Industries, Inc. highlight his role as a key innovator in the field. His inventions continue to influence the efficiency of bonding processes in the semiconductor industry.