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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10468373 B1

PDFFull Text
Date of Patent:
Nov. 05, 2019

Filed:

Feb. 19, 2018

Bonding machines for bonding semiconductor elements, methods of operating bonding machines, and techniques for improving uph on such bonding machines

Applicant:

Kulicke and Soffa Industries, Inc., Fort Washington, PA (US);

Inventors:

Thomas J. Colosimo, Jr., West Chester, PA (US);

Daniel P. Buergi, Chalfont, PA (US);

Horst Claubeg, Warwick, PA (US);

Matthew B. Wasserman, Philadelphia, PA (US);

Assignee:

Kulicke and Sofia Industries, Inc., Fort Washington, PA (US);

Attorney:

Christopher M. Spletzer, Sr.

Primary Examiner:

Kiley S Stoner

Int. Cl.
CPC ...
B23K 31/02 (2006.01); H01L 23/00 (2006.01); H01L 21/683 (2006.01); B23K 1/00 (2006.01); B23K 37/04 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 24/75 (2013.01); B23K 1/0016 (2013.01); B23K 37/04 (2013.01); H01L 21/6838 (2013.01); H01L 24/00 (2013.01); H01L 21/67144 (2013.01); H01L 2224/751 (2013.01); H01L 2224/755 (2013.01); H01L 2224/7565 (2013.01); H01L 2224/75501 (2013.01); H01L 2224/75803 (2013.01); H01L 2224/75804 (2013.01); H01L 2224/75824 (2013.01); H01L 2224/75981 (2013.01); H01L 2224/81203 (2013.01); H01L 2224/83203 (2013.01);
Abstract

A method of operating a bonding machine is provided. The method includes the steps of: (a) carrying a semiconductor element with a transfer tool; and (b) transferring the semiconductor element from the transfer tool to a bonding tool of the bonding machine without the transfer tool and the bonding tool contacting the semiconductor element at the same time.

Find Patent Forward Citations

Colosimo, Jr., Thomas. (2019). Bonding machines for bonding semiconductor elements, methods of operating bonding machines, and techniques for improving uph on such bonding machines (U.S. Patent No. 10468373). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10468373

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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