This inventor holds 1 USPTO granted patent and 2 published patent applications. Top assignee: Infineon Technologies Ag. Active years: 2022.
Company Filing History:
Years Active: 2022
Title: The Innovative Contributions of Daniel Obermeier
Introduction
Daniel Obermeier is a notable inventor based in Ensdorf, Germany. He has made significant contributions to the field of semiconductor technology. His work focuses on enhancing the efficiency and functionality of semiconductor packages.
Latest Patents
Obermeier holds a patent for a semiconductor package and method for fabricating a semiconductor package. This innovative design features a semiconductor package for double-sided cooling, which includes a first and a second carrier facing each other. The package also incorporates at least one power semiconductor chip arranged between the carriers, external contacts positioned at least partially between the carriers, and spring elements designed to maintain a predefined distance between the carriers. This invention is crucial for improving thermal management in semiconductor devices.
Career Highlights
Obermeier is currently employed at Infineon Technologies AG, a leading company in semiconductor solutions. His role involves developing advanced technologies that contribute to the efficiency and performance of electronic devices. With a focus on innovation, he has been instrumental in driving projects that enhance product capabilities.
Collaborations
Throughout his career, Obermeier has collaborated with talented professionals, including Juergen Hoegerl and Stephan Bradl. These partnerships have fostered a creative environment that encourages the exchange of ideas and expertise.
Conclusion
Daniel Obermeier's contributions to semiconductor technology exemplify the impact of innovative thinking in the industry. His patent for a semiconductor package showcases his commitment to advancing technology and improving device performance. His work continues to influence the field and inspire future innovations.